SiC Process Integration Engineer

onsemi
서울
Full time
4일 전
  • Lead SiC JFET process integration in technology development/transfer and qualifications for empowering onsemi’s SiC JFET technology leadership
  • Design/execute/analyze experiments to improve performance and yield for current and next generation technology to meet the requirement.
  • Manage process design/route, engineering run plan and their controls for delivering new technology/product development in timely manner
  • Analyze big data to identify weaknesses in process flow or root-cause of issues during fab process, and to drive process more robust and reliable.
  • Collaborate closely with the process engineering teams to develop new processes and to maintain sustainability
  • Create new test structures and test methodologies to monitor key performance/process parameters for continuous improvement in process and device.
  • Understand the technology/product performance margins and process corner, and set design rules and process control limits

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.


More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Required Qualifications

  • Bachelor’s degree with 10+ years or master’s degree with 8+ years of experience in process integration and/or device engineering
  • 5+ years of experience in SiC front-end integration for technology development or manufacturing
  • Ability to manage technology development planning and project schedules effectively
  • Deep understanding of semiconductor device physics and microelectronics
  • Sound understanding in manufacturing equipment, and knowledge in fab process/process optimization.
  • In-depth knowledge in statistical methods for experimental design and data analysis using MINITAB, JMP, Excensio and other statistical methods
  • Knowledge of failure analysis techniques
  • Strong verbal and written communication skills in English
  • The ideal candidate must have proven ability to achieve results in a fast moving, dynamic environment

Preferred Qualifications

  • Strong programming skills for automation is a plus
  • Knowledge/experience in TCAD modeling/simulation is a plus
  • Experience in wafer-level/product-level product test and/or reliability test is a plus
  • Experience in layout and tape out processes is a plus

Required Qualifications

  • Bachelor’s degree with 10+ years or master’s degree with 8+ years of experience in process integration and/or device engineering
  • 5+ years of experience in SiC front-end integration for technology development or manufacturing
  • Ability to manage technology development planning and project schedules effectively
  • Deep understanding of semiconductor device physics and microelectronics
  • Sound understanding in manufacturing equipment, and knowledge in fab process/process optimization.
  • In-depth knowledge in statistical methods for experimental design and data analysis using MINITAB, JMP, Excensio and other statistical methods
  • Knowledge of failure analysis techniques
  • Strong verbal and written communication skills in English
  • The ideal candidate must have proven ability to achieve results in a fast moving, dynamic environment

Preferred Qualifications

  • Strong programming skills for automation is a plus
  • Knowledge/experience in TCAD modeling/simulation is a plus
  • Experience in wafer-level/product-level product test and/or reliability test is a plus
  • Experience in layout and tape out processes is a plus
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